High Power on PCB Conference

Speaker: Elmir Midzic

With Fusion 360 Autodesk offers a platform for full product development. Think of smart products with challenges in geometry, electronics and possible resulting thermal issues. 

Fusion 360 Electronics and the e-cooling simulation as a part of this product design platform enables you to verify the thermal situations of high power circuits on the PCB and in its enclosure. This presentation will give an overview how product design is realized. Learn about the tight integration of ECAD and MCAD and the e-cooling options for your product design in Fusion 360.

Speaker: Richard Hammerl | Autodesk

"High current applications need reliable connections. This presentation offers an overview about modern connection technologies for power applications and provides helpful information

for the design process. Further topics will be environmental factors like temperature, vibrations etc. that have a strong influence on the selection of a connector as well as the integration

in the manufacturing process. In addition, new trends and technologies like hybrid or special data connectors for power devices will be introduced."

Speaker: Ansgar Kathmann | Phoenix Contact

"The demands on printed circuit boards are becoming more and more versatile. In addition to the trend towards ever higher packing density, current carrying capacity is playing an ever greater 

role. It is precisely for this area, where power and logic meet on one PCB, that we have developed our JUMA.SHAPE technology. Our SHAPE modules can be combined with standard 

manufacturing processes to form long-term stable power control units with optimised signal integrity and heat dissipation concepts, if necessary also in 3D configuration."

Speaker: Andreas Schilpp | JUMATECH GmbH

New ideas and technologies allow us to optimize the printed electromechanical relays and provide added value to the end users. The sustainable usage of relays in high power applications is nowadays possible.

This session will address the commercial and technical aspects of this endeavor: how is possible to control high currents and provide safety on the application? What about the generated heat and the long term performance of the relay, which is one of the most expensive components on PCB?

Let’s find out how the new relay technologies help us overcome those challenges and how the end application is optimized by introducing new and viable switching solutions.

Speaker: Panagiotis Venardos | Panasonic Industry

Electrification and Autonomous Driving are the main trends in the Automotive industry. The trend started with the electrification of auxiliaries followed by Mild Hybrid and Plug In Hybrid

vehicles. Today we see BEV´s in rising numbers on the streets. This trend also created a high demand for power electronics and high current solutions on PCB level. Several technologies

for the handling of high currents are available today from heavy copper to embedding of power electronic components into PCBs. The presentation will give an overview about these

technologies.

Speaker: Thomas Gottwald | Schweizer Electronic AG

Modern power electronics is the key to energy efficiency. Viewed against the background of ever increasing prices for raw materials and energy, the limited availability of the fossil fuels and the CO2 problem, it becomes obvious that our society will be forced to expend more care in its dealing with the resources of our planet as it has done in the past. 

Energy generation from renewable sources, the efficient use of electrical energy, as well as the creation of completely new mobility concepts can only be realized with a high proportion of leading-edge power electronics.

For those reasons, power electronics has experienced, for quite some time now, an enormous boom. 

The possibilities opened up by new high-performance components now allow very energy-efficient controls and systems, often in combination with a high integration density on the printed circuit boards.

In order to ensure the production of such electronic assemblies in safe process windows, there is already a high potential for quality and reliability of the final products in the layout of the printed circuit boards as well as in the process control of the soldering. These topics will be focused in the presentation.

Speaker: Juergen Friedrich | Ersa GmbH